3D Integration for VLSI SystemsAuthor :
Hardback
Published : Monday 26 September 2011
Description
Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC). Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers that are vertically bonded and interconnected by through silicon via TSV. This book presents contributions by key researchers in this field, covering motivations, technology platforms, applications, and other design issues.
You may also like ...
by
Paperback
13 May 2017
E-commerce: business aspects
€52.64
Extended stock – Dispatch 5-7 days
by
Paperback
13 May 2017
E-commerce: business aspects
€52.64
Extended stock – Dispatch 5-7 days
by
Paperback
22 Jun 2016
E-commerce: business aspects
€52.64
Extended stock – Dispatch 5-7 days
by
Paperback
22 Jun 2016
Human-computer interaction
€52.64
Extended stock – Dispatch 5-7 days
Reviews