Design of 3D Integrated Circuits and SystemsAuthor :
Hardback
Published : Wednesday 12 November 2014
Description
This book covers 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, the text discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs), addresses thermal management for multiprocessor systems-on-chip, and explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications.
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