Advanced Materials for InterconnectionsAuthor :
Hardback
Published : Thursday 18 December 1997
Description
Contains chapter related to Metallization that discusses cluster equipment for IC manufacturing, copper advanced technology, gap filling, mechanical reliability, deposition technology, electroless and electro-plating, copper metallization copper interconnects and patterning of aluminum. This book also covers Process Integration.
You may also like ...
by
Hardback
18 Dec 1997
Materials science
€245.70
Extended stock – Dispatch 5-7 days
Reviews