Materials for Electronic Packaging

Author : Deborah D.L. Chung

Hardback

Published : Friday 31 March 1995

ISBN : 9780750693141

Price : €216.45

Description

Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. This title examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips.

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