Semiconductor Packaging

Author : Andrea Chen,Randy Hsiao-Yu Lo

Paperback

Published : Monday 10 April 2017

ISBN : 9781138075405

Price : €84.23

Description

This easy-to-read book enables a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.

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